Prime Wafer Polishing Slurries
Nalco Water has supplied colloidal silica to the wafer industry for decades, and our comprehensive and wide-ranging expertise allow us to produce some of the highest quality silicon polishing slurries in the industry.
Our highly stable colloidal silica products offer exceptional purity, controlled particle size, distribution, and morphology for optimum performance in your prime wafer polishing processes.
Designing Wafer Polishing Slurries For:
High removal rates
Steady performance
Low defectivity
Ready-to-use Colloidal Silica Slurries for Silicon Wafer Polishing
- Size (nm): 60
- pH: 11
- Stabilizing: Na+
- Size (nm): 60
- pH: 8.5
- Stabilizing: Na+
- Size (nm): 85
- pH: 11-12
- Stabilizing: NH4
- Notes: Chelating additive
- Size (nm): 85
- pH: 11-12
- Stabilizing: NH4
- Notes: High Si removal rate. Hazardous.
- Size (nm): 120
- Area m2/gm: 25
- % Solids: 47
- pH: 9-10
- Stabilizing: K+
Addressing Multiple Polishing Applications
Our colloidal silica-based polishing slurries are widely used for the stock polish, edge polish and final polish steps in the manufacture of silicon wafers and other semiconductor substrates for microchips.
These slurries are also used in the precision surface finishing of optics, watch crystals and other glass components.
Innovating for the Needs of CMP Slurry Formulators
Nalco Water has aligned our colloidal silica manufacturing capabilities to deliver high-purity, innovative nanoparticles to meet the needs of the CMP slurry formulator.
- Ultra-high purity waterglass-based nanoparticles
- Broad range of particle sizes, size distributions, and concentrations
- Engineered products designed to be stable across a broad pH range
- Strong research-to-research collaboration
Nalco Water is a Colloidal Silica Leader
- First patented colloidal silica manufacturing process in 1941
- One of the largest colloidal silica manufacturers globally
- Innovative RD&E teams for customized product development
- Products designed for manufacturing efficiency, quality, and control
- Delivering high value through innovative particle design and quality support
References
- Products were made using LMSII engineered approach to remove metals; [Cu] and [Ni] less than 20 ppb. Availability subject to the volume.↵